WHAT IS THERMAL RELIEF & ANTI PAD ?

In this tutorial we are going to learn about WHAT IS THERMAL RELIEF & ANTI PAD ?

ANTI PAD: The area of copper etched away around a via or a PTH on a power/GND plane, thereby

preventing an electrical connection being made to that plane.

THERMAL RELIEF PAD  :   A special pattern etched around a via or a PTH to connect it into a PWR or GND plane. A thermal relief pad is necessary to prevent too much heat being absorbed into the PWR/GND plane when the board is being soldered. The width will be about 10-20 mils & gap is 20 mils (generally).

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